Electronic component transportation device and method for manufacturing electronic component array

ABSTRACT

An electronic component transportation device includes a rotation path and a first magnetic force generator. The rotation path extends along a transportation direction of an electronic component with a rectangular or substantially rectangular parallelepiped shape. The rotation path is inclined with respect to a horizontal direction. The rotation path includes a first surface and a second surface intersecting with each other. The first magnetic force generator is arranged at a lateral side of the rotation path.

CROSS REFERENCE TO RELATED APPLICATIONS

This application claims the benefit of priority to Japanese PatentApplication 2015-178798 filed Sep. 10, 2015, the entire contents of thisapplication are hereby incorporated herein by reference.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to an electronic component transportationdevice and a method for manufacturing an electronic component array.

2. Description of the Related Art

As one type of electronic components, a multilayer ceramic capacitor hasbeen known. In the multilayer ceramic capacitor, a plurality of innerelectrodes and a ceramic dielectric layer are laminated.

The multilayer ceramic capacitor is mounted on a substrate for use, ingeneral. When the multilayer ceramic capacitor is mounted on thesubstrate, mechanical strength is different, a stray capacitance valuevaries, and so on between the case in which the lamination direction ofthe inner electrodes is parallel to the surface of the substrate and thecase in which the lamination direction thereof is perpendicular to thesurface of the substrate in some cases.

Furthermore, the magnitude of acoustic noise is different between thecase in which the lamination direction of the inner electrodes isparallel to the surface of the substrate and the case in which thelamination direction thereof is perpendicular to the surface of thesubstrate in some cases. The “acoustic noise” referred herein indicatessound that is generated when the substrate vibrates due to distortion ofthe multilayer ceramic capacitor, which is caused by fluctuation ofvoltage to be applied.

Accordingly, it is desired that the multilayer ceramic capacitor ismounted on the substrate in a state in which the lamination direction ofthe inner electrodes is aligned with a predetermined direction.

Japanese Unexamined Patent Application Publication No. 2011-018698discloses an example of an electronic component transportation devicealigning a multilayer ceramic capacitor with a predetermined direction.The transportation device disclosed in Japanese Unexamined PatentApplication Publication No. 2011-018698 has a first transportation path,a rotation path, and a second transportation path. A first magnet isprovided in the rotation path so as to apply a magnetic force to anelectronic component such that inner electrodes in the electroniccomponent extend in a predetermined direction. The rotation path hastransition guide walls, and a gap between the walls is narrower towardan end portion connected to the second transportation path.

The electronic component transportation device disclosed in JapaneseUnexamined Patent Application Publication No. 2011-018698 has a problemthat a posture of the electronic component passing through the rotationpath tilts and the electronic component is easily stuck.

SUMMARY OF THE INVENTION

Accordingly, preferred embodiments of the present invention provide anelectronic component transportation device in which an electroniccomponent is unlikely to be stuck in a transportation path.

A first electronic component transportation device according to apreferred embodiment of the present invention includes a rotation pathand a first magnetic force generator. The rotation path extends along atransportation direction of an electronic component preferably with arectangular or substantially rectangular parallelepiped shape. Therotation path is inclined with respect to a horizontal direction. Therotation path includes a first surface and a second surface intersectingwith each other. The first magnetic force generator is arranged at alateral side of the rotation path.

In the first electronic component transportation device according to apreferred embodiment of the present invention, it is preferable that anangle defined by the first surface and the second surface is not 90° orabout 90°.

In the first electronic component transportation device according to apreferred embodiment of the present invention, it is preferable that anangle defined by the first surface and the second surface is larger thanabout 90°.

In the first electronic component transportation device according to apreferred embodiment of the present invention, it is preferable that thefirst magnetic force generator is at a lateral side of the first surfaceof the rotation path, and an inclination angle of the first surface withrespect to the horizontal direction is larger than an inclination angleof the second surface with respect to the horizontal direction.

In the first electronic component transportation device according to apreferred embodiment of the present invention, it is preferable that acenter line passing through an N pole and an S pole of the firstmagnetic force generator passes through the first surface, and L1>D/2 issatisfied when a minimal distance between an intersection of the centerline and the first surface and an intersection of the first and secondsurfaces is assumed to be L1 and a larger dimension of a width and aheight of the electronic component is assumed to be D.

It is preferable that the first electronic component transportationdevice according to a preferred embodiment of the present inventionfurther include a second magnetic force generator at a lateral side ofthe second surface of the rotation path and at a downstream siderelative to the first magnetic force generator.

It is preferable that the first electronic component transportationdevice according to a preferred embodiment of the present inventioninclude a cover covering the rotation path.

A second electronic component transportation device according to anotherpreferred embodiment of the present invention includes a rotation pathand a first magnetic force generator. The rotation path includes a firstpath portion and a second path portion. The first path portion extendsalong a transportation direction of an electronic component. The firstpath portion is inclined with respect to a horizontal direction. Thefirst path portion includes first and second surfaces intersecting witheach other. The second path portion extends along the transportationdirection. The second path portion is inclined with respect to thehorizontal direction. The second path portion includes third and fourthsurfaces intersecting with each other. The second path portion islocated at the first surface side of the first path portion. An upperend of the first surface and an upper end of the fourth surface areconnected. A minimal distance between a lower end and the upper end ofthe first surface is smaller than a larger dimension of a width and aheight of the electronic component to be transported. The first magneticforce generator is arranged at a lateral side of the third surface ofthe rotation path.

In the second electronic component transportation device according to apreferred embodiment of the present invention, it is preferable thatS1>S2 is satisfied when an area of a portion of a surface of the firstmagnetic force generator facing the third surface, which is overlappedwith the third surface in a direction perpendicular or substantiallyperpendicular to the third surface, is assumed to be S1 and an area of aportion of the surface of the first magnetic force generator facing thethird surface, which is not overlapped with the third surface, isassumed to be S2.

A method for manufacturing an electronic component array according to astill another preferred embodiment of the present invention includes astep of aligning lamination directions of a plurality of electroniccomponents using the first or second electronic component transportationdevice.

It is preferable that the method for manufacturing an electroniccomponent array according to a preferred embodiment of the presentinvention further include a step of accommodating the plurality ofelectronic components in a tape such that the lamination directions ofthe plurality of electronic components are aligned.

Preferred embodiments of the present invention provide an electroniccomponent transportation device in which an electronic component isunlikely to be stuck in a transportation path.

The above and other elements, features, steps, characteristics andadvantages of the present invention will become more apparent from thefollowing detailed description of the preferred embodiments withreference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic perspective view illustrating a portion of anelectronic component transportation device according to a firstpreferred embodiment of the present invention.

FIG. 2 is a schematic perspective view illustrating an electroniccomponent that is transported according to the first preferredembodiment of the present invention.

FIG. 3 is a schematic cross-sectional view cut along a line III-III inFIG. 2.

FIG. 4 is a schematic cross-sectional view illustrating the electroniccomponent transportation device according to the first preferredembodiment of the present invention.

FIG. 5 is a schematic cross-sectional view illustrating the electroniccomponent transportation device according to the first preferredembodiment of the present invention.

FIG. 6 is a schematic cross-sectional view illustrating the electroniccomponent transportation device according to the first preferredembodiment of the present invention.

FIG. 7 is a schematic cross-sectional view illustrating an electroniccomponent transportation device according to a second preferredembodiment of the present invention.

FIG. 8 is a schematic cross-sectional view illustrating an electroniccomponent transportation device according to a third preferredembodiment of the present invention.

FIG. 9 is a schematic cross-sectional view illustrating the electroniccomponent transportation device according to the third preferredembodiment of the present invention.

FIG. 10 is a schematic cross-sectional view illustrating the electroniccomponent transportation device according to the third preferredembodiment of the present invention.

FIG. 11 is a schematic cross-sectional view illustrating an electroniccomponent transportation device according to a fourth preferredembodiment of the present invention.

FIG. 12 is a schematic cross-sectional view illustrating an electroniccomponent array according to a fifth preferred embodiment of the presentinvention.

FIG. 13 is a schematic cross-sectional view cut along a line XII-XII inFIG. 12.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, examples of preferred embodiments of the present inventionwill be described. It should be noted that the following preferredembodiments are merely examples. The present invention is not limited bythe following preferred embodiments at all.

In each of the drawings that are referred in the preferred embodimentsand the like, the same reference numerals denote members having the sameor substantially the same functions. Furthermore, the drawings that arereferred in the preferred embodiments and the like are schematicallyillustrated. Ratios and the like of dimensions of objects drawn in thedrawings are different from ratios and the like of dimensions of actualobjects in some cases. The ratios and the like of the dimensions of theobjects are different among the drawings in some cases. The specificratios and the like of the dimensions of the objects should bedetermined by considering the following description.

First Preferred Embodiment

FIG. 1 is a schematic perspective view illustrating a portion of anelectronic component transportation device according to a preferredembodiment of the present invention. An electronic componenttransportation device 2 illustrated in FIG. 1 is a device thattransports an electronic component 1. The electronic component 1 that istransported is not particularly limited and preferably has a rectangularor substantially rectangular parallelepiped shape, for example.

To be specific, in the present preferred embodiment, an example in whichthe electronic component 1 illustrated in FIG. 2 and FIG. 3 istransported by the electronic component transportation device 2 will bedescribed.

FIG. 2 is a schematic perspective view illustrating the electroniccomponent 1 that is transported in the present preferred embodiment.FIG. 3 is a schematic cross-sectional view cut along a line III-III inFIG. 2.

The electronic component 1 illustrated in FIG. 2 and FIG. 3 preferablyis a capacitor having a rectangular or substantially rectangularparallelepiped shape, for example. To be specific, the electroniccomponent 1 preferably is a multilayer ceramic capacitor having arectangular or substantially rectangular parallelepiped shape, forexample. It is preferable for the electronic component 1 to have largeelectrostatic capacitance which can easily generate acoustic noise, inparticular, it is preferable for the electronic component 1 having anelectrostatic capacitance equal to or larger than about 1 μF or equal toor larger than about 10 μF.

The electronic component of various preferred embodiments of the presentinvention is not limited to the capacitor. In preferred embodiments ofthe present invention, the electronic component may be a thermistor, aninductor, or the like.

The electronic component 1 includes a main body 10. The main body 10preferably has a rectangular or substantially rectangular parallelepipedshape, for example. It should be noted that the rectangular orsubstantially rectangular parallelepiped shape encompasses a rectangularparallelepiped shape and a shape formed by rounding corners and ridgeline portions of the rectangular parallelepiped shape.

As illustrated in FIG. 3, the main body 10 includes first and secondmain surfaces 10 a and 10 b, first and second side surfaces 10 c and 10d, and first and second end surfaces 10 e and 10 f. Each of the firstand second main surfaces 10 a and 10 b extends along a length directionL and a width direction W. The length direction L and the widthdirection W are perpendicular or substantially perpendicular to eachother. Each of the first and second side surfaces 10 c and 10 d extendsalong the length direction L and a height direction H. The heightdirection H is perpendicular or substantially perpendicular to each ofthe length direction L and the width direction W. Each of the first andsecond end surfaces 10 e and 10 f extends along the width direction Wand the height direction H.

A dimension of the main body 10 in the length direction L is larger thandimensions thereof in the width direction W and the height direction Hand the dimension of the main body 10 in the width direction W is equalor substantially equal to a dimension of the main body 10 in the heightdirection H. To be specific, the dimension of the main body 10 in thewidth direction W is equal to or larger than about 0.8 times as andequal to or smaller than about 1.2 times as the dimension of the mainbody 10 in the height direction H, for example. It should be noted thatthe dimension of the main body 10 in the width direction W and thedimension thereof in the height direction H may be different. Theelectronic component transportation device according to a preferredembodiment of the present invention is more advantageous than anexisting transportation device to transport and rotate the electroniccomponent 1 in the following point. That is, the electronic componenttransportation device according to a preferred embodiment of the presentinvention is capable of being applied to the electronic component 1 inwhich the dimension of the main body 10 in the width direction W and thedimension thereof in the height direction H are different.

To be specific, as a dimension facilitating rotation of the electroniccomponent 1 with magnetic force, in the present preferred embodiment, itis preferable that the dimension of the electronic component main body10 in the length direction L be equal to or larger than about 0.6 mm andequal to or smaller than about 2.0 mm, for example. It is preferablethat the dimension of the electronic component main body 10 in the widthdirection W be equal to or larger than about 0.3 mm and equal to orsmaller than about 1.0 mm, for example. It is preferable that thedimension of the electronic component main body 10 in the heightdirection H be equal to or larger than about 0.3 mm and equal to orsmaller than about 1.0 mm, for example.

The electronic component main body 10 preferably is made of dielectricceramics as a main component for obtaining electrostatic capacitance.Specific examples of the dielectric ceramics include BaTiO₃, CaTiO₃,SrTiO₃, and the like. A sub component content of which is smaller thanthat of the main component, such as Mn compound, Mg compound, Sicompound, Fe compound, Cr compound, Co compound, Ni compound, andrare-earth compound, for example, may be appropriately added to theelectronic component main body 10 in accordance with characteristicsrequired for the electronic component 1. The dielectric ceramic materialis preferably ferroelectric ceramic and relative dielectric constantthereof is preferably equal to or higher than about 2000, and morepreferably equal to or higher than about 3000, for example. In thiscase, the electrostatic capacitance of equal to or larger than about 1μF or equal to or larger than about 10 μF is able to be achieved withinthe above-described dimensional range of the electronic component mainbody 10. The electronic component 1 easily generates acoustic noise andpreferred embodiments of the present invention are able to be preferablyapplied thereto.

As illustrated in FIG. 3, a plurality of first inner electrodes 11 and aplurality of second inner electrodes 12 defining inner conductors areprovided in the electronic component main body 10.

The first inner electrodes 11 and the second inner electrodes 12 arealternately laminated along the height direction H and oppose each otherwith a ceramic portion 10 g interposed therebetween in the heightdirection H. From the viewpoint that the numbers of inner electrodes 11and 12 are increased to accelerate rotation with magnetic force, thethickness of the ceramic portion 10 g is preferably equal to or smallerthan about 1 μm, for example. It should be noted that when the ceramicportion 10 g is too thin, voltage resistance is lowered in some cases.Accordingly, the thickness of the ceramic portion 10 g is preferablyequal to or larger than about 0.3 μm, for example. The total number ofthe inner electrodes 11 and 12 is preferably equal to or larger thanabout 350, for example.

The first inner electrodes 11 extend along the length direction L andthe width direction W. The first inner electrodes 11 extend to the firstend surface 10 e. The first inner electrodes 11 do not extend to thefirst and second main surfaces 10 a and 10 b, the first and second sidesurfaces 10 c and 10 d, and the second end surface 10 f.

The second inner electrodes 12 extend along the length direction L andthe width direction W. The second inner electrodes 12 extend to thesecond end surface 10 f. The second inner electrodes 12 do not extend tothe first and second main surfaces 10 a and 10 b, the first and secondside surfaces 10 c and 10 d, and the first end surface 10 e.

Each of the first and second inner electrodes 11 and 12 contains metal,in particular, ferromagnetic metal. Specific examples of the preferablyused ferromagnetic metal include Ni, Fe, and an alloy containing atleast one of Ni and Fe.

A first outer electrode 13 is provided on the first end surface 10 e.The first outer electrode 13 reaches portions of the first and secondmain surfaces 10 a and 10 b and the first and second side surfaces 10 cand 10 d from the first end surface 10 e. The first outer electrode 13is connected to the first inner electrodes 11 on the first end surface10 e.

A second outer electrode 14 is provided on the second end surface 10 f.The second outer electrode 14 reaches portions of the first and secondmain surfaces 10 a and 10 b and the first and second side surfaces 10 cand 10 d from the second end surface 10 f. The second outer electrode 14is connected to the second inner electrodes 12 on the second end surface10 f.

Each of the first and second outer electrodes 13 and 14 includes atleast one type of Pt, Au, Ag, Cu, Ni, Cr, and the like, for example.

Next, an electronic component transportation device 2 will be describedin detail with reference to FIG. 1 and FIG. 4 to FIG. 6. It should benoted that FIG. 4 to FIG. 6 are schematic cross-sectional viewsillustrating a rotation path when seen from the upstream side in thetransportation direction.

The electronic component transportation device 2 includes atransportation path 20 (see FIG. 1). The transportation path 20 isconnected to an accommodation portion (not illustrated) accommodatingtherein the plurality of electronic components 1. Each electroniccomponent 1 is supplied from the accommodation portion to thetransportation path 20. The electronic component 1 transported in thetransportation path 20 is inserted into an insertion portion (notillustrated) for inserting the electronic component 1.

The electronic component 1 is transported in the transportation path 20along the length direction L of the electronic component 1. A rotationpath 21 is provided in the transportation path 20.

As illustrated in FIG. 4, the rotation path 21 includes a first surface21 a and a second surface 21 b. The first surface 21 a extends along thetransportation direction of the electronic component 1 and is inclinedwith respect to the horizontal direction. That is to say, the firstsurface 21 a defines an angle that is not equal to about 0° or about 90°with respect to the horizontal direction. The second surface 21 bextends along the transportation direction of the electronic component 1and is inclined with respect to the horizontal direction. That is tosay, the second surface 21 b defines an angle that is not equal to about0° or about 90° with respect to the horizontal direction. The firstsurface 21 a extends toward the second surface 21 b from the upper endto the lower end. The second surface 21 b extends toward the firstsurface 21 a from the upper end to the lower end. The first and secondsurfaces 21 a and 21 b intersect with each other. That is to say, thefirst surface and second surface 21 a and 21 b define a V-shaped orsubstantially V-shaped groove on a cross section perpendicular orsubstantially perpendicular to the transportation direction and thevertical direction. Each of the first surface 21 a and the secondsurface 21 b is a flat surface. An angle θ defined by the first surface21 a and the second surface 21 b is larger than about 90°, for example.

When an angle of the first surface 21 a with respect to the horizontaldirection, which is defined as an acute angle, is assumed to θ1 and anangle of the second surface 21 b with respect to the horizontaldirection, which is defined as an acute angle, is assumed to θ2, θ1 andθ2 may be the same as or different from each other but it is preferablethat θ1 be larger than θ2. For example, θ1 preferably is equal to orlarger than about 20° and equal to or smaller than about 55° preferably,and equal to or larger than about 30° and equal to or smaller than about45° more preferably. For example, θ2 preferably is equal to or largerthan about 10° and equal to or smaller than about 45° preferably, andequal to or larger than about 20° and equal to or smaller than about 35°more preferably. The difference between θ1 and θ2 is preferably equal toor larger than about 1° and equal to or smaller than about 30°preferably and is equal to or larger than about 10° and equal to orsmaller than about 20° more preferably.

A first magnetic force generator 24 a is arranged at one lateral side ofthe rotation path 21. To be specific, the first magnetic force generator24 a is arranged at the lateral side (x1 side) of the first surface 21a. To be more specific, the first magnetic force generator 24 a isarranged such that a center line passing through an N pole and an S polethereof is inclined with respect to the horizontal direction and onesurface of the S pole and the N pole thereof is parallel orsubstantially parallel to the first surface 21 a. The first magneticforce generator 24 a is arranged such that the center line passingthrough the S pole and the N pole thereof and the first surface 21 a areperpendicular or substantially perpendicular to each other.

A second magnetic force generator 24 b is arranged at the other lateralside of the rotation path 21. To be specific, the second magnetic forcegenerator 24 b is arranged at the lateral side (x2 side) of the secondsurface 21 b. To be more specific, the second magnetic force generator24 b is arranged such that a center line passing through an N pole andan S pole thereof is inclined with respect to the horizontal directionand one surface of the S pole and the N pole thereof is parallel orsubstantially parallel to the second surface 21 b. The second magneticforce generator 24 b is arranged such that the center line passingthrough the N pole and the S pole and the first surface 21 a areperpendicular or substantially perpendicular to each other. The secondmagnetic force generator 24 b is arranged at the downstream siderelative to the first magnetic force generator 24 a in thetransportation direction of the electronic component 1. Magnetic forceof the second magnetic force generator 24 b is weaker than magneticforce of the first magnetic force generator 24 a. When seen from thetransportation direction of the electronic component 1, the center linepassing through the N pole and the S pole of the first magnetic forcegenerator 24 a passes through the second magnetic force generator 24 b.The center line passing through the N pole and the S pole of the secondmagnetic force generator 24 b passes through the first magnetic forcegenerator 24 a. The center line of the first magnetic force generator 24a and the center line of the second magnetic force generator 24 b arelocated on one straight line.

It is possible that only the first magnetic force generator may beprovided in a preferred embodiment of the present invention.

Each of the first magnetic force generator 24 a and the second magneticforce generator 24 b generates magnetic force. Each of the firstmagnetic force generator 24 a and the second magnetic force generator 24b may include a permanent magnet or an electromagnet, for example.

The electronic component 1 is transported from the upstream side to thedownstream side in the rotation path 21 by being made to vibrate, forexample. The electronic component 1 is transported in a state in whichany surface of the first and second main surfaces 10 a and 10 b and thefirst and second side surfaces 10 c and 10 d extends along the first orsecond surface 21 a or 21 b. When θ1 is larger than θ2, the electroniccomponent 1 is easily transported in a state in which any surface of thefirst and second main surfaces 10 a and 10 b and the first and secondside surfaces 10 c and 10 d extends along the second surface 21 b. Fromthe viewpoint that the electronic component 1 is made easier to betransported in the state of extending along the second surface 21 b, θ1is larger than θ2 by equal to or more than about 1° preferably, and byequal to or more than about 10° more preferably, for example.

As illustrated in FIG. 4, when the lamination direction of the innerelectrodes 11 and 12 of the electronic component 1 transported to therotation path 21 is parallel or substantially parallel to the secondsurface 21 b, that is, when the first or second side surface 10 c or 10d of the electronic component 1 extends along the second surface 21 b,the electronic component 1 rotates about the length direction L with themagnetic force generated by the first magnetic force generator 24 a.Then, as illustrated in FIG. 5, the first or second side surface 10 c or10 d of the electronic component 1 extends along the first surface 21 afinally, and the lamination direction of the inner electrodes 11 and 12and one surface of the S pole and the N pole of the first magnetic forcegenerator 24 a are parallel or substantially parallel with each other.The electronic component 1 that has passed through the rotation path istransported to the downstream side in the transportation path 20 in astate of extending along the first surface 21 a.

As illustrated in FIG. 6, even when the electronic component 1 istransported to the rotation path 21 in a state in which the laminationdirection of the inner electrodes 11 and 12 is perpendicular orsubstantially perpendicular to the second surface 21 b, the electroniccomponent 1 slightly rotates about the length direction L with themagnetic force generated by the first magnetic force generator 24 a, andis transported to the downstream side in the transportation path 20 in astate of being along the first surface 21 a as illustrated in FIG. 5.Thus, in the electronic component transportation device 2, when thelamination direction of the inner electrodes 11 and 12 of the electroniccomponent 1 transported to the rotation path 21 is parallel orsubstantially parallel with or is perpendicular to the second surface 21b, as illustrated in FIG. 5, the electronic component 1 is transportedin the state in which the lamination direction of the inner electrodes11 and 12 of the electronic component 1 is parallel or substantiallyparallel to the first surface 21 a, that is, in the state in which thefirst or second side surface 10 c or 10 d of the electronic component 1extends along the first surface 21 a.

It should be noted that when the electronic component transported to therotation path 21 makes contact with the first surface 21 a and the firstor second side surface 10 c or 10 d of the electronic component 1extends along the second surface 21 b, the electronic component 1 doesnot rotate in the rotation path 21.

As described above, in the electronic component transportation device 2,the electronic component 1 rotates even without a gap to rotate theelectronic component 1 and the lamination direction of the innerelectrodes 11 and 12 of the electronic component 1 is aligned in therotation path 21. The electronic component 1 before reaching a region inwhich the first magnetic force generator 24 a is provided is transportedalong the first or second surface 21 a or 21 b extending along thetransportation direction. Thereafter, the electronic component 1 thathas rotated in the rotation path 21 and the electronic component 1 thathas not rotated therein are transported in the rotation path 21 alongthe first surface 21 a. Therefore, the length direction L of theelectronic component 1 is unlikely to tilt with respect to thetransportation direction. Accordingly, the electronic component 1 isunlikely to be stuck in the rotation path 21.

The electronic component transportation device 2 includes the secondmagnetic force generator 24 b in addition to the first magnetic forcegenerator 24 a. The second magnetic force generator 24 b is arranged atthe downstream side relative to the first magnetic force generator 24 a.Therefore, the lamination direction of the inner electrodes 11 and 12 ofthe electronic component 1 that has passed through the rotation path isaligned more reliably. Furthermore, the state in which the electroniccomponent 1 extends along the first surface 21 a in the rotation path 21is able to be held. Accordingly, the electronic component 1 is moreunlikely to be stuck in the rotation path 21.

From the viewpoint that the electronic component 1 is made easy torotate, the angle θ defined by the first surface 21 a and the secondsurface 21 b is larger than about 90° preferably, and θ1 is larger thanθ2 preferably, for example. In this case, the electronic component 1 ismade easy to be transported along the second surface 21 b in therotation path 21 and the first surface 21 a and the electronic component1 are separated from each other. Therefore, the electronic component 1is made easy to rotate.

From the viewpoint that the electronic component 1 is made easier torotate, θ is equal to or larger than about 91° preferably, and equal toor larger than about 100° more preferably, for example. It should benoted that θ is too large, the electronic component 1 tends to tiltduring the transportation. Accordingly, θ is equal to or smaller thanabout 120° preferably, and equal to or smaller than about 110° morepreferably, for example.

From the viewpoint that the electronic component 1 is made easier torotate, as illustrated in FIG. 5, the first magnetic force generator 24a is preferably arranged such that a center line S passing through the Npole and the S pole of the first magnetic force generator 24 a passesthrough the first surface 21 a. To be specific, a relation between aminimal distance L1 between an intersection of the center line S and thefirst surface 21 a and an intersection of the first and second surfacesand a height H of the electronic component 1 satisfies L1>H/2preferably.

The electronic component transportation device 2 includes a cover 30.This prevents sticking-out of the electronic component 1 that istransported from the rotation path 21 and needless displacement thereofin the rotation path 21.

Hereinafter, other examples of preferred embodiments of the presentinvention will be described. In the following description, commonreference numerals denote members having substantially common functionsto those in the above-described first preferred embodiment anddescription thereof is omitted.

Second Preferred Embodiment

FIG. 7 is a schematic cross-sectional view illustrating a rotation path21A according to a second preferred embodiment of the present invention.To be specific, FIG. 7 is a schematic cross-sectional view illustratingthe rotation path 21A when seen from the upstream side in thetransportation direction. A transportation device 2 a in the presentpreferred embodiment is different from the transportation device 2 inthe first preferred embodiment in a point that the angle defined by thefirst surface 21 a and the second surface 21 b is smaller than about90°, for example.

In the present preferred embodiment, the angle defined by the firstsurface 21 a and the second surface 21 b preferably is smaller thanabout 90°, for example. In this case, the electronic component 1 istransported in a state of making contact with both of the first andsecond surfaces 21 a and 21 b, to be specific, in a state of makingsubstantially point contact therewith. Therefore, displacement of theelectronic component in the horizontal direction during transportationis restricted and tilt of the length direction L of the electroniccomponent 1 with respect to the transportation direction is prevented.Accordingly, the electronic component 1 is unlikely to be stuck in thetransportation path 20. Furthermore, the angle defined by the first andsecond surfaces 21 a and 21 b preferably is smaller than about 90°, forexample. Therefore, a contact area between the electronic component 1and the rotation path 21A is small. Accordingly, the electroniccomponent 1 is able to be made to rotate easily.

From the viewpoint that the sticking of the electronic component 1 isreduced or prevented more effectively, θ is equal to or smaller thanabout 89° preferably, and equal to or smaller than about 75° morepreferably, for example. It should be noted that when θ is too small,the electronic component 1 excessively rotates. Accordingly, θ is equalto or larger than about 30° preferably, and equal to or larger thanabout 45° more preferably, for example.

The first preferred embodiment has described a non-limiting example inwhich θ is equal to or larger than about 90° and the second preferredembodiment has described a non-limiting example in which θ is equal toor smaller than about 90°. It should be noted that the present inventionis not limited thereto. θ may be 90°, for example.

Third Preferred Embodiment

FIGS. 8 to 10 are schematic cross-sectional views illustrating anelectronic component transportation device 2 b according to a thirdpreferred embodiment of the present invention. It should be noted thatFIGS. 8 to 10 are schematic cross-sectional views illustrating arotation path when seen from the upstream side in the transportationdirection.

As illustrated in FIG. 8 to FIG. 10, in the third preferred embodiment,a rotation path 21B includes a first path portion 21B1 and a second pathportion 21B2.

The first path portion 21B1 has the first surface 21 a and the secondsurface 21 b intersecting with each other. Each of the first and secondsurfaces 21 a and 21 b extends along the transportation direction of theelectronic component 1 and is inclined with respect to the horizontaldirection. That is to say, each of the first and second surfaces 21 aand 21 b defines an angle that is not equal to about 0° or about 90°with respect to the horizontal direction. The first surface 21 a extendstoward the second surface 21 b from the upper end to the lower end. Thesecond surface 21 b extends toward the first surface 21 a from the upperend to the lower end. The first surface 21 a and the second surface 21 bintersect with each other. That is to say, the first surface 21 a andthe second surface 21 b define a V-shaped or substantially V-shapedgroove on a transverse cross section perpendicular or substantiallyperpendicular to the transportation direction and the verticaldirection. Each of the first and second surfaces 21 a and 21 b is a flatsurface. The angle defined by the first surface 21 a and the secondsurface 21 b is preferably about 90°, for example.

The second path portion 21B2 is located at a lateral side (x1 side) ofthe first path portion 21B1. The second path portion 21B2 includes athird surface 21 c and a fourth surface 21 d intersecting with eachother. Each of the third and fourth surfaces 21 c and 21 d extends alongthe transportation direction of the electronic component 1 and isinclined with respect to the horizontal direction. That is to say, eachof the third and fourth surfaces 21 c and 21 d defines an angle ofneither about 0° nor about 90° with respect to the horizontal direction.The third surface 21 c extends toward the fourth surface 21 d from theupper end to the lower end. The fourth surface 21 d extends toward thethird surface 21 c from the upper end to the lower end. The thirdsurface 21 c and the fourth surface 21 d intersect with each other. Thatis to say, the third surface 21 c and the fourth surface 21 d define aV-shaped or substantially V-shaped groove on a transverse cross sectionperpendicular or substantially perpendicular to the transportationdirection and the vertical direction. Each of the third and fourthsurfaces 21 c and 21 d is a flat surface. An angle defined by the thirdsurface 21 c and the fourth surface 21 d is preferably about 90°, forexample.

The upper end of the fourth surface 21 d of the second path portion 21B2and the upper end of the first surface 21 a of the first path portion21B1 are connected.

A minimal distance between the lower end and the upper end of the firstsurface 21 a is smaller than a larger dimension D of the width and theheight of the electronic component 1 that is transported.

The first magnetic force generator 24 a is arranged at a lateral side ofthe rotation path 21B at the third surface 21 c side. To be specific,the first magnetic force generator 24 a is arranged such that onesurface of the S pole and the N pole of the first magnetic forcegenerator 24 a is parallel or substantially parallel to the thirdsurface 21 c. The first magnetic force generator 24 a is arranged suchthat the center line passing through the N pole and the S pole thereofand the third surface 21 c are perpendicular or substantiallyperpendicular to each other. In the present preferred embodiment, onlythe first magnetic force generator 24 a is provided and no secondmagnetic force generator is provided.

As illustrated in FIG. 8, the electronic component 1 is transported fromthe upstream side while passing through the first path portion 21B1. Theelectronic component 1 that has reached the rotation path 21B istransported in the first path portion 21B1 when the lamination directionof the inner electrodes 11 and 12 directs to a desired direction. Inthis case, the electronic component 1 is transported in a state ofmaking contact with the first and second surfaces 21 a and 21 b.Therefore, the electronic component 1 is transported in a state in whichthe length direction L thereof extends along the transportationdirection. Alternatively, the electronic component 1 moves to the secondpath portion 21B2 and is transported in the second path portion 21B2 ina state in which the lamination direction of the inner electrodes 11 and12 directs to a desired direction in some cases.

As illustrated in FIG. 9, the electronic component 1 that has reachedthe rotation path 21B moves to the second path portion 21B2 whilerotating with magnetic force by the first magnetic force generator 24 a,as illustrated in FIG. 10, when the lamination direction of the innerelectrodes 11 and 12 does not direct to the desired direction. Theelectronic component 1 that has moved to the second path portion 21B2 istransported in the second path portion 21B2. In this case, theelectronic component 1 is transported in a state of making contact withthe third and fourth surfaces 21 c and 21 d. Therefore, the electroniccomponent 1 is transported in a state in which the length direction Lthereof extends along the transportation direction.

As described above, the electronic component 1 is transported in thefirst or second path portion 21B1 or 21B2 extending along thetransportation direction. Therefore, the length direction L of theelectronic component 1 is unlikely to tilt with respect to thetransportation direction. Accordingly, sticking of the electroniccomponent 1 in the transportation path 20 is significantly reduced orprevented.

From the viewpoint that the electronic component 1 is made easy torotate in a desired direction, it is preferable that S1>S2 is satisfiedwhen an area of a portion of a surface of the first magnetic forcegenerator 24 a facing the third surface 21 c, which is overlapped withthe third surface 21 c in the direction perpendicular or substantiallyperpendicular to the third surface 21 c, is assumed to be S1 and an areaof a portion of the surface of the first magnetic force generator 24 afacing the third surface 21 c, which is not overlapped with the thirdsurface 21 c, is assumed to be S2.

Fourth Preferred Embodiment

FIG. 11 is a schematic cross-sectional view illustrating atransportation device 2 c according to a fourth preferred embodiment ofthe present invention. It should be noted that FIG. 11 is a view whenseen from the upstream side in the transportation direction of theelectronic component 1.

In a preferred embodiment of the present invention, it is sufficientthat the first and second magnetic force generators 24 a and 24 b arearranged so as to cause magnetic lines thereof to pass through theelectronic component 1 passing through the rotation path 21. The firstto third preferred embodiments have described the case in which thefirst and second magnetic force generators 24 a and 24 b preferably arearranged such that the center line passing through the N pole and the Spole is perpendicular or substantially perpendicular to the opposingsurface. The present invention is however not limited to thisconfiguration.

In the fourth preferred embodiment, as illustrated in FIG. 11, the firstmagnetic force generator 24 a is arranged such that one surface of the Spole and the N pole thereof is perpendicular or substantiallyperpendicular to the first surface 21 a and the second magnetic forcegenerator 24 b is arranged such that one surface of the S pole and the Npole thereof is perpendicular or substantially perpendicular to thesecond surface 21 b. Each of the first and second magnetic forcegenerators 24 a and 24 b is arranged such that the center line passingthrough the S pole and the N pole is parallel or substantially parallelto the opposing surface. Even in this case, the electronic component 1is able to be made to rotate such that the lamination direction of theinner electrodes 11 and 12 of the electronic component 1 extends in adesired direction.

Furthermore, a straight line connecting the S pole and the N pole of thefirst magnetic force generator 24 a may be along the transportationdirection of the electronic component 1.

Fifth Preferred Embodiment

An electronic component array 3 as illustrated in FIG. 12 and FIG. 13 isformed by taping the plurality of electronic components 1. Theelectronic component array 3 includes an elongated tape 40. Asillustrated in FIG. 13, the tape 40 includes an elongated carrier tape41 and an elongated cover tape 42. The carrier tape 41 includes aplurality of cavities 43 provided at an interval along the lengthwisedirection. The cover tape 42 is provided on the carrier tape 41 so as tocover the plurality of cavities 43. The electronic component 1 isaccommodated in each of the plurality of cavities 43. For example, theplurality of electronic components 1 are arranged such that the secondmain surfaces 10 b face the bottom surface sides of the cavities 43.With this, the plurality of electronic components 1 are mounted on awiring substrate such that the lamination directions of the innerelectrodes 11 and 12 are parallel or substantially parallel to a normalline direction of the wiring substrate. Therefore, the plurality ofelectronic components 1 of the taping electronic component array 3 aremounted such that the first main surfaces 10 a thereof are sucked andheld and the second main surfaces 10 b face the wiring substrate.Alternatively, the plurality of electronic components 1 are arrangedsuch that the second side surfaces 10 c face the bottom surfaces of thecavities 43. With this, the plurality of electronic components 1 aremounted such that the lamination directions of the inner electrodes 11and 12 are perpendicular or substantially perpendicular to the normalline direction of the wiring substrate. Therefore, the plurality ofelectronic components 1 of the electronic component array 3 are mountedsuch that the first side surfaces 10 c thereof are sucked and held andthe first side surfaces 10 c face the wiring substrate. It should benoted that the carrier tape 40 may be made of resin or paper, forexample.

The electronic component array 3 is preferably manufactured as follows.For example, the lamination directions of the plurality of electroniccomponents 1 are aligned using the transportation device 2 of theelectronic components 1. Subsequently, each of the electronic components1 is accommodated in each of the plurality of cavities 43 of the carriertape 41. Then, the cavities 43 accommodating therein the electroniccomponents 1 are closed by the cover tape 42. With this, the electroniccomponent array 3 is manufactured.

While preferred embodiments of the present invention have been describedabove, it is to be understood that variations and modifications will beapparent to those skilled in the art without departing from the scopeand spirit of the present invention. The scope of the present invention,therefore, is to be determined solely by the following claims.

What is claimed is:
 1. An electronic component transportation devicecomprising: a first magnetic force generator that is arranged at onelateral side of a first surface of a rotation path; wherein the firstmagnetic force generator is arranged such that a center line passingthrough an N pole and an S pole thereof is inclined with respect to ahorizontal direction.
 2. The electronic component transportation deviceaccording to claim 1, wherein the first magnetic force generator isarranged such that the center line passing through the S pole and the Npole thereof and the first surface of the rotation path areperpendicular or substantially perpendicular to each other.
 3. Theelectronic component transportation device according to claim 1, whereinone surface of the S pole and the N pole thereof is parallel orsubstantially parallel to the first surface of the rotation path.
 4. Theelectronic component transportation device according to claim 1, whereinthe rotation path includes the first surface and a second surface thatintersect with each other, extend along a transportation direction of anelectronic component having a rectangular or substantially rectangularparallelepiped shape, and are inclined with respect to the horizontaldirection.
 5. The electronic component transportation device accordingto claim 4, wherein an angle defined by the first surface and the secondsurface is neither 90° nor about 90°.
 6. The electronic componenttransportation device according to claim 4, wherein an angle defined bythe first surface and the second surface is larger than about 90°. 7.The electronic component transportation device according to claim 4,wherein an angle defined by the first surface and the second surface is90°.
 8. The electronic component transportation device according toclaim 4, wherein an inclination angle of the first surface with respectto the horizontal direction is larger than an inclination angle of thesecond surface with respect to the horizontal direction.
 9. Theelectronic component transportation device according to claim 4, whereinthe center line passing through the N pole and the S pole of the firstmagnetic force generator passes through the first surface; and L1>D/2 issatisfied when a minimal distance between an intersection of the centerline and the first surface and an intersection of the first and secondsurfaces is L1 and a larger dimension of a width and a height of theelectronic component is D.
 10. The electronic component transportationdevice according to claim 4, further comprising a second magnetic forcegenerator at a lateral side of the second surface in the rotation pathand at a downstream side relative to the first magnetic force generator.11. The electronic component transportation device according to claim 1,further comprising a cover covering the rotation path.
 12. A method formanufacturing an electronic component array comprising aligninglamination directions of a plurality of electronic components using theelectronic component transportation device according to claim
 1. 13. Themethod for manufacturing the electronic component array according toclaim 12, further comprising accommodating in a tape the plurality ofelectronic components in which the lamination directions thereof havebeen aligned.